Heat Sinks Using Second Generation NanoSpreader Vapor Chambers Outperform Heat Pipe Solutions by 30 Per cent
San Jose, California, (ANTARA News/PRNewswire-AsiaNet) - Already credited with making vapor chambers (a once exotic heat sink technology) thin, light and affordable, Celsia Technologies ("Celsia") (OTC Bulletin Board: CSAT) today introduces its second generation NanoSpreader.
Thermal transfer properties from the heat source to the vapor have been improved by 66 per cent over the first generation, using a re-engineered internal structure that leverages the company's patented combination of copper, liquid and vapor.
"Our engineers have designed this next generation product to offer up to 30 per cent better thermal performance than solutions using traditional heat pipes, and their design flexibility allows them to be used in some unexpected ways," said Joe Formichelli, Celsia's CEO.
"For instance, a single NanoSpreader can be made up to 70mm wide and attach directly to the heat source, eliminating the need for additional components while completely covering even a very large hot spot."
The latest generation technology costs about the same as heat pipes and is ideally suited for solving some of today's biggest thermal challenges.
Computer - Cooling the Latest Microprocessors Celsia's new NanoSpreaders can cool power densities up to 150 watts/cm2 while offering excellent multi-directional thermal spreading as low as 0.02o Celsius per watt. Additionally, NanoSpreaders can withstand clamping forces up to 90 PSI, giving thermal designers the option of attaching them directly to the CPU GPU.
Telecommunications Infrastructure - Reliably Operating in Harsh Environments With no moving parts, Celsia NanoSpreaders are designed and tested to withstand repeated exposure of -40 o to +100 o Celsius.
LED Lighting - Effectively Dissipating Heat in Small Spaces The efficiency of Celsia's NanoSpreaders combined into a remarkably thin package (from 1.5mm) allows lighting designs with higher lumens/watt.
For more information on Celsia or the technical details behind NanoSpreaders please visit our English web site (www.celsiatech.com) or contact one of our Asia offices.
General Asia Sales Contact: Sobo Sun Office: +886-3-462-3452
Mobile: +886-935-186-945 E-Mail: ssun@celsiatechnologies.com
Korea and Japan Sales Contact: J.J. Choi Office:
+82-2-3452-2005 Mobile: +82-10-5500-3452 E-Mail:
jjchoi@celsiatechnologies.com
About Celsia Technologies
Celsia Technologies is a full solution provider and licensor of thermal management products and technology for the PC, consumer electronics, lighting and display industries. Celsia Technologies' has offices in Taiwan, Korea, and the United States.
Forward Looking Statements
This announcement contains forward-looking statements involving risks and uncertainties that may cause Celsia's actual results to be materially different from any future results expressed or implied by such statements, such as Celsia's ability to attract investors, Celsia's future operating results, and general economic conditions. Celsia undertakes no obligation to revise any of these statements to reflect future circumstances.
SOURCE: Celsia Technologies
CONTACT: Sobo Sun, General Asia Sales, Office
+886-3-462-3452, Mobile +886-935-186-945,
ssun@celsiatechnologies.com,
or Korea and Japan Sales, J.J. Choi, Office +82-2-3452-2005,
Mobile +82-10-5500-3452, jjchoi@celsiatechnologies.com,
both of Celsia Technologies
Web site: http://www.celsiatech.com
San Jose, California, (ANTARA News/PRNewswire-AsiaNet) - Already credited with making vapor chambers (a once exotic heat sink technology) thin, light and affordable, Celsia Technologies ("Celsia") (OTC Bulletin Board: CSAT) today introduces its second generation NanoSpreader.
Thermal transfer properties from the heat source to the vapor have been improved by 66 per cent over the first generation, using a re-engineered internal structure that leverages the company's patented combination of copper, liquid and vapor.
"Our engineers have designed this next generation product to offer up to 30 per cent better thermal performance than solutions using traditional heat pipes, and their design flexibility allows them to be used in some unexpected ways," said Joe Formichelli, Celsia's CEO.
"For instance, a single NanoSpreader can be made up to 70mm wide and attach directly to the heat source, eliminating the need for additional components while completely covering even a very large hot spot."
The latest generation technology costs about the same as heat pipes and is ideally suited for solving some of today's biggest thermal challenges.
Computer - Cooling the Latest Microprocessors Celsia's new NanoSpreaders can cool power densities up to 150 watts/cm2 while offering excellent multi-directional thermal spreading as low as 0.02o Celsius per watt. Additionally, NanoSpreaders can withstand clamping forces up to 90 PSI, giving thermal designers the option of attaching them directly to the CPU GPU.
Telecommunications Infrastructure - Reliably Operating in Harsh Environments With no moving parts, Celsia NanoSpreaders are designed and tested to withstand repeated exposure of -40 o to +100 o Celsius.
LED Lighting - Effectively Dissipating Heat in Small Spaces The efficiency of Celsia's NanoSpreaders combined into a remarkably thin package (from 1.5mm) allows lighting designs with higher lumens/watt.
For more information on Celsia or the technical details behind NanoSpreaders please visit our English web site (www.celsiatech.com) or contact one of our Asia offices.
General Asia Sales Contact: Sobo Sun Office: +886-3-462-3452
Mobile: +886-935-186-945 E-Mail: ssun@celsiatechnologies.com
Korea and Japan Sales Contact: J.J. Choi Office:
+82-2-3452-2005 Mobile: +82-10-5500-3452 E-Mail:
jjchoi@celsiatechnologies.com
About Celsia Technologies
Celsia Technologies is a full solution provider and licensor of thermal management products and technology for the PC, consumer electronics, lighting and display industries. Celsia Technologies' has offices in Taiwan, Korea, and the United States.
Forward Looking Statements
This announcement contains forward-looking statements involving risks and uncertainties that may cause Celsia's actual results to be materially different from any future results expressed or implied by such statements, such as Celsia's ability to attract investors, Celsia's future operating results, and general economic conditions. Celsia undertakes no obligation to revise any of these statements to reflect future circumstances.
SOURCE: Celsia Technologies
CONTACT: Sobo Sun, General Asia Sales, Office
+886-3-462-3452, Mobile +886-935-186-945,
ssun@celsiatechnologies.com,
or Korea and Japan Sales, J.J. Choi, Office +82-2-3452-2005,
Mobile +82-10-5500-3452, jjchoi@celsiatechnologies.com,
both of Celsia Technologies
Web site: http://www.celsiatech.com
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